IC360 – One stop shopping platform for IC chips & electronic components

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Why IC360

IC360 is committed to providing customers with professional, high-quality and fast PCB assembly turnkey solution. From WLCSP & flip-chip to the smallest passive and oddly-shaped components, high density assembly, low voiding soldering, proper underfll, edge bonding - including PCB protection with nano coating and conformal coating - and understanding materials impact on signal integrity, we can help you apply the latest technologies and techniques for flawless assembly and maximum performance.

Turnkey

PCB Manufacturing, components sourcing and in-house assembly, whole project management available at IC360

Quick-turn Prototyping

Support from 1 to 300 pcs quantities, enable you to go from design to function prototype faster and with confidence

On-Demand Fabrication

Agile fabrication process meets demand, Experienced Team offers fantastic experience

Strong Supply Chain Management

Deep cooperation with 3000+ original electronic components manufacturers and their authorized agents and distributors

Smart BOM System

Intelligently recognizing ,analyzing, matching, comparing and recommending for your non-template BOM list by uploading without registration

Overall Cost Reduction

Eliminate intermediate brokers,Reduce costs by 15%-45%, Improve purchase and production efficiency

Equipment and Capacity

Board size

Minimum board size: 50mm x 50mm
Maximum board size: 400mm x 550mm & 1200mm x 260mm

Soldering Type

Provides PCBA soldering services for surface mount (SMT), post-in-plug (THT) or both

PCB board type

PCB board (FR-4, metal substrate), PCB flexible board (FPC), Rigid-flex PCB

PCB Stencil

Laser stencils are used to ensure that components such as small-pitch ICs and BGAs meet IPC-2 Class or higher standards.

Component size

High-precision IC such as BGA: with a pitch of Min 0.25mm.
Passive components: we accept components as small as 01005 (EIA inch code).

Component packaging

For SMT components, we accept reels, cut tapes, tubes and pallets package.
THT components in bulk is also accepted.

Quality Control

IQC: incoming inspection;
IPQC: in-production inspection;
Visual QC: routine quality inspection;
AOI: Check solder paste, soldering effect of SMD components, few parts or component polarity;
X-Ray: Check BGA, QFN and other high-precision hidden PAD components;
Functional testing: According to the customer's testing procedures and steps, the function and performance are tested to ensure compliance with the requirements.
Burn-in test: Test function and performance according to customer's test procedures and procedures to ensure compliance with requirements.

Processing Equipment

Loader
1. Board time: 6s/pcs
2. Step interval: 10/20/30/40 mm
3. PCB size: W250*L330mm(Max) W50*L50mm(Min)

Printer
1. Printing cycle: 13s/pcs
2. Accuracy: ±0.025mm
3. PCB size: W310*L400mm(Max) W50*L50mm(Min)

High-speed SMT
1. Component size: 01005-2220 (EIA inch code)
2. Speed: 42000 cph
3. Accuracy: ±40μm
4. PCB size: W300*L510mm(Max) W50*L50mm(Min)

Multifunctional SMT
1. Component size: 0402-150*25*30 (diagonal 152mm)
2. Speed: 18000 cph
3. Accuracy: ±30μm
4. PCB size: W300*L510(Max) W50*L50mm(Min)

Reflow soldering
1. Temperature zone configuration: 10 temperature zones, 20 heating modules
2. Temperature control accuracy: ±1℃
3. PCB width: Min50mm-Max300mm (simultaneously) Min50mm-Max550mm (single rail)

Optical detector
1. Camera resolution: 15μm
2. PCB size: W330*L480(Max) W25*L25mm(Min)

Plug-in line
1. Number of workstations: 8
2. PCB width: 50mm-350mm

Wave soldering
1. Chain speed: 500-1800mm/min
2. Temperature control accuracy: ±2°C
3. Temperature control
accuracy: ±2°C 4. Substrate width: 50mm-350mm

Wire and assembly line
1. Number of workstations: 10
2. The transmission speed is adjustable