Description: Opening (unsealing) is mainly to use instruments to corrode the package on the surface of the chip to check whether there is a wafer inside, the size of the wafer, the manufacturer's logo, the copyright year, and the wafer code to determine the authenticity of the chip.
We shall use range: other chip authenticity verification and failure analysis.
Opening test picture:
Picture of opening test equipment:
Introduction to opening test
The decap test, also known as DECAP, is a destructive experiment. It uses chemical reagent methods or laser etching to remove the external package shell of the component to check the original logo, layout, process defects, etc. on the surface of the die. Testing is an auxiliary testing method.
Opening (unblocking) range
Common packages COB, BGA, QFP, QFN, SOT, TO, DIP, BGA, COB ceramic, metal and other special packages. Generally there are chemical (Chemical) unsealing, mechanical (Mechanical) unsealing, laser (Laser) unsealing, PlasmaDecap
Decap laboratory can handle almost all IC packaging forms (COB.QFP.DIPSOT, etc.) and wire bonding types (AuCuAg).
Precautions for opening (unsealing)
All operations should be carried out in a fume hood, and acid-proof gloves should be worn.
The more the product is opened, the less acid should be dropped, and clean it frequently to avoid over-corrosion.
Be careful not to touch the gold wire and chip surface with the tweezers during the cleaning process to avoid scratching the chip and gold wire.
According to product or analysis requirements, some conductive glue or the second point under the chip should be exposed after opening the cap.
In addition, in some cases, the products that have been capped should be retested according to the row. At this time, you should first observe whether the gold wire on the chip is broken or collapsed under an 80x microscope. If not, use a blade to scrape the black film on the pin and send it for testing.
Pay attention to control the temperature of opening the cap not to be too high.
